| Technical Centers MICRO BONDING GROUP Team Lead: Tammy Hawke |
WHAT IS MICRO BONDING?
Machines attach wires by means of an ultrasonic and thermosonic wedge bonding process using heat, force and
ultrasonic energy to fuse each end of the wire to devices such as integrated circuits, multi chip modules, hybrids,
chip on board
and other type packages.
Example:
Machines
Here at SiDet the Bonding Group has three K&S 8090 fully Automatic large Area Wedge Bonders. The 8090’s
have incredibly fast speeds, bonding 5 wires per second; along with the finest pitch capability and bond placement
accuracy in wedge
bonding available today.
The
8090’s are equipped with heat temperature controllers that allow the capability
of using gold wire application.
Along with the 8090’s we have three K&S 1478 fully automatic or semi automatic wedge bonders. They also have
large Table travel of 12 by 8 inches, which gives
an 11 by 7 inch bonding area.
Wire
Currently
we are using 1.0 MIL 1% silicon 99% aluminum wire
8090 Wedge bonder 1478 Wedge Bonder
Some of our Customers:
CDF
& DZERO detector projects
Brookhaven
National Laboratory
CERN
Dark
Energy Camera