CMS - The Hadron Calorimeter
Project
Front-End Electronics
HPD Interface Module Assembly Information
3 Types of HB HPD Interface Module
All
three types of the HB HPD interface cards share the same BOM. We have asked the board manufacturer to
produce 2x3 arrays of the individual cards. HB_Type2 and HB_Type4 share identical placement; HB_Type_2
is different. There will be a
quantity of 48 (or 6 2x3 arrays)
of each type to be assembled.
HB_Type2_Top_Assembly (pdf)
HB_Type3_Top_Assembly (pdf)
HB_Type4_Top_Assembly (pdf)
Bill_Of_Materials (pdf)
HB_Type3
HB_Gerber_files (zip)
HB_Cad_File (cad)
HB_X_Y_Placement (xls)
HB_Types 2 and 4
HB_Gerber_files (zip)
HB_Cad_File (cad)
HB_X_Y_Placement (xls)
3 Types of HE HPD Interface Module
All three types of the HE HPD
interface cards share the same BOM.
We have asked the board manufacturer to produce 2x2 arrays of the
individual cards. All HE_Types
share identical placement. There
will be a quantity of 48 (or 12 2x2 arrays) of each type to be assembled.
HE_Type2_Top_Assembly (pdf)
HE_Type3_Top_Assembly (pdf)
HE_Type4_Top_Assembly (pdf)
Bill_Of_Materials (pdf)
HE_Gerber_files (zip)
HE_Cad_File (cad)
HE_X_Y_Placement (xls)
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